发明名称 |
Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly |
摘要 |
Simultaneous non-contact plating and planarizing of copper interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode and a metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.
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申请公布号 |
US6143155(A) |
申请公布日期 |
2000.11.07 |
申请号 |
US19980096131 |
申请日期 |
1998.06.11 |
申请人 |
SPEEDFAM IPEC CORP. |
发明人 |
ADAMS, JOHN A.;KRULIK, GERALD A.;SMITH, EVERETT D. |
分类号 |
C25D5/04;C25D7/12;H01L21/288;H01L21/321;H01L21/768;(IPC1-7):C25D5/00 |
主分类号 |
C25D5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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