发明名称 AFTER-ETCHING TREATMENT METHOD FOR PROTECTING SURFACE AGAINST CORROSION CHARACTERIZED BY PLASMA ETCHING
摘要 PROBLEM TO BE SOLVED: To realize a method of markedly reducing or eliminating surface corrosion of an etched metal-containing feature section. SOLUTION: As a part of an after-etching treatment, before pollutants causing corrosion are removed from the surface, moisture is prevented from being condensed by use of high vacuum, a moisture-free inactive purge gas, and the fact that a substrate is kept at a temperature sufficiently high for water to evaporate. When moisture is condensed on a surface before pollutants which cause corrosion to the etched copper surface are removed, it is important that pollutants located surrounding the etched surface, especially pollutants which may form copper carbonate and/or copper sulfate be prevented from coming into contact with the surface. An after-etching treatment contains a method, where a plasma or a gas which contains at least a reactive hydrogen-containing seed is brought into contact with the etched features.
申请公布号 JP2000311889(A) 申请公布日期 2000.11.07
申请号 JP20000074450 申请日期 2000.03.16
申请人 APPLIED MATERIALS INC 发明人 YE YAN;SHAOIE ZUAO;SHAN-RIN SHE;SHEN-CHAN TEN;WAN-CHAN TOU;CHUN-FU TSUU;MA DIANA XIAOBING
分类号 H01L21/302;H01L21/02;H01L21/3065;H01L21/3205;H01L21/3213;H01L23/52;(IPC1-7):H01L21/306;H01L21/321;H01L21/320 主分类号 H01L21/302
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