| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable high-frequency circuit substrate which will not have fluctuations of spatial discharge characteristic and circuit operation caused by foreign material deposition, humidity, etc., and also to provide a method for manufacturing the substrate. SOLUTION: A wiring pattern 21 (22) for the passage of a high frequency signal and a ground potential wiring pattern 23 are positioned close to each other on the surface of a dielectric substrate 1, and a hallow part 5 is provided at a site closest to the both patterns 21 (22) and 23 to form a glass coated film 4. Furthermore, prior to the formation of the glass coated film 4, a resin member 5' of resin paste is formed at the closest site, a coated film 4' to be later formed as the glass coated film 4 is formed, and then the resin member 5' is burned out by a sintering process (de-binder processing) to form the hollow part 5.
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