发明名称 |
High density electronic circuit modules |
摘要 |
The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.
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申请公布号 |
US6143582(A) |
申请公布日期 |
2000.11.07 |
申请号 |
US19990249012 |
申请日期 |
1999.02.12 |
申请人 |
KOPIN CORPORATION |
发明人 |
VU, DUY-PHACH;DINGLE, BRENDA;CHEONG, NGWE |
分类号 |
A61B3/113;G02B5/30;G02B27/00;G02B27/01;G02F1/1333;G02F1/1335;G02F1/1347;G02F1/136;G02F1/1362;G09G3/30;G09G3/32;G09G3/36;H01L21/77;H01L21/822;H01L21/84;H01L25/075;H01L27/06;H01L27/12;H01L27/15;H01L29/786;H01L33/00;H01S5/02;H01S5/42;H04N5/70;H04N5/74;H05B33/12;(IPC1-7):H10L21/00 |
主分类号 |
A61B3/113 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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