| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device which is capable of preventing signals from being delayed due to capacitance in signal lines reducing power supply/ground noises. SOLUTION: An inner circuit 14 and a ground pad 11, and a power supply pad 11 and a signal pad 13 are connected together with pad wiring layers 31, 32, and 33 respectively. Wiring layers 34, 35, 36, and 37 are formed extending under the pad wiring layers 31, 32, and 33 in a wiring region between the pads and the inner circuit, so as to surround the inner circuit 14. The wiring layers 35 and 36 are connected to the power supply pad wiring layer 32 via contacts 24, and a gap 30 occupied by an insulating film is provided between the wiring layers 35 and 36. The signal wiring layer 33 crosses the wiring layers 34 to 37 at right angles in a plan view.
|
