| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an appreciably handleable and efficient punching device and punching method for wiring boards. SOLUTION: For micro-punching a workpiece board 4 via pressing, the wiring board punching device comprises a table 3 on which the workpiece board 4 is placed, a punch-projecting jig 1 with needle projections of a diameter of 0.1 mm or less and a height approximately of 1 to 2 m, and a pressure table 2. Following the wiring board micro-punching by the punching device, the wiring board punching method carries out drilling or laser drilling. The workpiece board micro-punching may be by rolling employing a pair of rollers on either of which the punch-projection jig 1 is wound.</p> |
