| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition excellent in moisture resistance reliability, storage stability, ejecting operability and coating operability by making the composition include an epoxy resin, phenolic resin, latent curing promoter, etc., and setting the viscosity of the composition to be at specified levels at specific temperatures, respectively. SOLUTION: This composition is obtained by being made to include (A) an epoxy resin, pref. a liquid epoxy resin such as bisphenol F-type one, (B) a phenolic resin, pref. a solid phenolic resin such as polyfunctional one, (C) a latent curing promoter, and (D) an inorganic filler, pref. spherical fused silica powder, and setting the viscosity of the composition at >=7,000 p at 25 deg.C and <=5,000 p at 80 deg.C, wherein the component C is pref. a microencapsulated type curing promoter having core/shell structure where a core portion consisting of a curing promoter such as triphenylphosphine is coated with a shell portion consisting mainly of a polymer composed of structural unit of the formula (R is a bivalent or trivalent organic group; R1 and R2 are each H or the like).
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