发明名称 |
KLXX technology with integrated passivation process, probe geometry and probing process |
摘要 |
A method of exposing a bond pad includes: providing an integrated circuit having a bond pad, a first passivation layer overlying an area portion of the bond pad, and a second passivation layer overlying the first passivation layer; removing a portion of the second passivation layer above the area portion of the bond pad exposing an area of the first passivation layer; curing the second passivation; and etching a portion of the exposed area of the first passivation layer to expose the top surface of the bond pad. A method of coupling an integrated circuit chip to a chip package is also disclosed as is a method of probing the bond pads of an integrated circuit. A probe card is further disclosed, including a probe assembly coupled to a printed circuit board, the probe assembly having a sloped sidewall portion with a plurality of probing beams extending from the sidewall portion.
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申请公布号 |
US6143668(A) |
申请公布日期 |
2000.11.07 |
申请号 |
US19970941795 |
申请日期 |
1997.09.30 |
申请人 |
INTEL CORPORATION |
发明人 |
DASS, M. LAWRENCE A.;KARKLIN, KENNETH D.;SESHAN, KRISHNA;ROGGEL, AMIR |
分类号 |
H01L21/60;H01L21/768;H01L23/485;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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