发明名称 DISCHARGE PLASMA TREATING METHOD
摘要 PROBLEM TO BE SOLVED: To form a thin film high in transparency on the surface of a base material with high efficiency. SOLUTION: In a method in which the space between counter electrodes 11 and 12 arranged under pressure in the vicinity of the atmospheric pressure is applied with the electric field to generate discharge plasma and the discharge plasma is used to form a thin film on the surface of a base material F, a previous stage of discharge plasma treatment is provided with a base material heating and drying device (e.g. a heating roll 4). The region from the base material drying device to the discharge plasma treatment part is coated with a vessel 5, and the inside of this vessel 5 is filled with dry gas and/or heating gas so that, before the treatment of the base material F with discharge plasma, the base material F is dried and, moreover, during a base material transport to a discharge plasma treating section, the humidity reabsorption of the base material F is prevented.
申请公布号 JP2000309871(A) 申请公布日期 2000.11.07
申请号 JP19990118181 申请日期 1999.04.26
申请人 SEKISUI CHEM CO LTD 发明人 NAKAO HITOSHI
分类号 H01L21/31;C23C16/02;C23C16/50;C23C16/515;H05H1/24 主分类号 H01L21/31
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