发明名称 Process of impregnating substrate and impregnated substrate
摘要 Process of impregnating a layer substrate having openings which is substantially defined by opposing two main surfaces with a resin composition in the form of liquid, and the process is characterized in that one of the main surfaces and the resin composition are kept in such a contact condition that the substrate is located on the resin composition. A prepreg and a laminate are also provided which are produced by the use of the substrate which has been prepared by the above process.
申请公布号 US6143369(A) 申请公布日期 2000.11.07
申请号 US19960773947 申请日期 1996.12.30
申请人 MATSUSHITA ELECTRIC WORKS, LTD. 发明人 SUGAWA, YOSHIHISA;TOHRIN, YASUO;MARUMOTO, YOSHINOBU;SAKAKIBARA, JOJI;SHINOTANI, KEN-ICHI;KOTERA, KOHEI;OGASAWARA, KENJI;KASHIHARA, KEIKO;IWAMI, TOMOAKI
分类号 B29B15/12;H05K1/03;(IPC1-7):B05D1/36;B05D1/18 主分类号 B29B15/12
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