发明名称 |
Wafer-to-wafer transfer of microstructures using break-away tethers |
摘要 |
Break-away tethers to secure electronic, mechanical, optical, or other microstructures, during release from one substrate and transfer to another. Microstructures are fabricated with integrated tethers attaching them to a first substrate. The structures are undercut by etching and contacted and bonded to a second substrate. First and second substrates are separated, breaking the tethers.
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申请公布号 |
US6142358(A) |
申请公布日期 |
2000.11.07 |
申请号 |
US19970866954 |
申请日期 |
1997.05.31 |
申请人 |
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
发明人 |
COHN, MICHAEL B.;HOWE, ROGER T. |
分类号 |
B23K1/00;B81B7/00;H01L21/68;(IPC1-7):B23K31/02;B23K1/018;H01L23/52;B65G49/07 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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