| 摘要 |
PURPOSE: A polishing apparatus having a cooling pad and a polishing method using the same are provided to ensure a wafer production yield at a low cost with a high efficiency and a high productivity by not using a slurry. CONSTITUTION: CMP(Chemical Mechanical Polishing) device is used to polish a material layer formed on a wafer by using a low-temperature chemical polishing process. A polished wafer is mounted to a bottom of the CVD. During the polishing process, a wafer temperature and a pressure applied to a backside of the wafer can be uniformly maintained. The cooling pad is positioned to a position facing the wafer head. A surface is planarized to be proper for a wafer polishing. A chemical needed for the polishing is self-provided during the polishing process. A cooling container encloses a bottom and a side of the cooling pad. The cooling part is mounted to a bottom of the cooling container, and is used to form the cooling pad. The CMP device further includes a chamber having no moisture. Thereby, the polishing apparatus ensures a wafer production yield at a low cost with a high efficiency and a high productivity by not using a slurry.
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