HIGH-RELIABILITY NON CONDUCTIVE ADHESIVE(NCA) FOR NON-SOLDER FLIP CHIP'S BONDING

摘要

PURPOSE: A non conductive adhesive(NCA) for a non-solder flip chip's bonding is provided to enable NCA to have mechanical and electrical characteristics. CONSTITUTION: A non-conductive adhesive(NCA) includes A-type epoxy resin, F-type epoxy resin, a phenoxy resin, a solvent, a liquid hardening material and a non-conductive particle. The epoxy resin is a solid bisphenol A-type epoxy resin. The F-type epoxy resin is a liquid bisphenol F-type epoxy resin. A methylethylketone and toluene are mixed in a solvent. The non-conductive adhesive(NCA) has a film shape.