| 摘要 |
PURPOSE: A method for machining holes of a substrate using an arc is provided to simultaneously punch a plurality of holes formed in a substrate. CONSTITUTION: A parent material(20) includes an upper surface copper membrane(22) and a lower surface copper membrane(22') on the upper and lower surface of an insulating material comprised of a fiber polymer. Holes for electrically connecting the circuit patterns formed on the upper surface copper membrane(22) and the lower surface copper membrane(22') are punched. To punch the holes, an arc is used. An opening portion(23) for forming holes in the copper membrane(22) of the parent material(20) is made in advance. The holes are punched by supplying a DC or AC power source and generating an arc at the margin portion of the opening portion(23).
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