发明名称 |
Method for precise placement of an array of single particles on a surface |
摘要 |
Methods and apparatus are disclosed for efficiently and precisely adhering and centering particles on tacky areas on a surface containing an array of tacky and non-tacky areas. These methods and apparatus for particle attachment and centering involve holding and heating of the surface containing an array of tacky and non-tacky areas with particles adhered thereon for a period of time and at a temperature to allow the particles to adhere and center to the tacky areas. The surface containing the array of tacky and non-tacky areas can be heated either prior to, during or after a step of contacting the array with particles. Either discrete sheets or a continuous moving web of material having a surface containing an array of tacky and non-tacky areas can be employed. Each tacky area of an array of tacky and non-tacky areas has a size and bonding strength suitable for adhesion of one particle thereto in formation of an array. The array is populated with conductive-particles, is useful in the precise placement of particles on contact pads of electronic devices, such as circuit boards in semiconductor applications.
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申请公布号 |
US6143374(A) |
申请公布日期 |
2000.11.07 |
申请号 |
US19980018669 |
申请日期 |
1998.02.04 |
申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
CAIRNCROSS, ALLAN;GANTZHORN, JR., JOHN EDWIN |
分类号 |
H01L21/48;H05K3/34;(IPC1-7):B05D1/12 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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