| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device and a manufacturing method thereof where a chip is bonded to a board via bumps and the reliability of the bump bonding is raised. SOLUTION: For a semiconductor device manufacturing method comprising steps of forming metal (solder) bumps 16 in a wafer state, coating a resin 20 for protecting the wiring surface of a semiconductor chip 21 in a wafer state, and cutting the semiconductor chip 21 out of a wafer, the metal bumps 16 are bonded to the wiring surface of the chip 21 in the form of necked roots, and the resin 20 is coated to cover the roots of the metal bumps 16. |
