PROCEDE DE FABRICATION DE DISPOSITIF ELECTRONIQUE PORTABLE A CIRCUIT INTEGRE PROTEGE PAR RESINE PHOTOSENSIBLE

摘要

The invention relates to a method for producing a portable electronic device with an integrated circuit, characterized in that comprises the following steps: a resin wipe is deposited around the chip of an integrated circuit and connection wires, whereby said resin is highly viscous and can be polymerized with U.V.s; a low-viscosity filling resin which can be polymerized with U.V.s is deposited in the space defined by the resin wipe; the protective resins are polymerized by exposure to U.V.s. The invention is further characterized in that the filling resin comprises mechanically reinforcing fibers. The entire inventive method is carried out in a continuous manner.