发明名称 LEAD WIRE CONNECTING STRUCTURE FOR THIN-FILM-SHAPED METAL BODY
摘要 PROBLEM TO BE SOLVED: To prevent oxidization of a connecting portion and connect a thin film sensor to a lead wire with high strength even under high temperature environment, by coating the connecting portion between a metal body and the lead wire with an adhesive containing conductive material for adhesion. SOLUTION: An electrode portion 4 and a lead wire 6 are adhered to each other through high-melting-point amorphous brazing filler material 8 in a resistance welding method. Next, an adhesive 9 is applied to a connecting portion 7 with a brush. At this time, the entire connecting portion 7 is coated with the adhesive 9. When this is put into a furnace and burned at about 600-700 deg.C, the binder in the adhesive 9 is removed and metal paste is sintered. Thus, the electrode portion 4 and the lead wire are adhered to each other through the high-melting-point amorphous brazing filler material 8 in a state where they are coated with the adhesive 9. In this lead wire connecting structure of the thin-film-shaped metal body, since the connecting portion 7 is coated with the adhesive 9, the connecting portion 7 is not exposed to air and can be prevented from being oxidized or degrading even when a thin-film sensor is used under high temperature environment higher than 600 deg.C.
申请公布号 JP2000311732(A) 申请公布日期 2000.11.07
申请号 JP19990118779 申请日期 1999.04.26
申请人 ISHIKAWAJIMA HARIMA HEAVY IND CO LTD 发明人 IDA FUTOSHI;TERASAKI KIMIHIRO
分类号 H01R4/02;(IPC1-7):H01R12/04 主分类号 H01R4/02
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