Surface acoustic wave device having bump electrodes and method for producing the same

摘要

An electronic element includes a substrate (1) with electrode pads (2) provided thereon. Intermediate electrodes (3) include base electrodes (4) on the bottom surface of the intermediate electrodes, and the bottom surface of the intermediate electrodes are disposed on the electrode pads (2). Bump electrodes (6) are provided on the intermediate electrodes (3) and include a metal having a melting point of about 450 DEG C or more. Further, the base electrodes (4) include a metallic material that can reduce orientation of the intermediate electrodes (3).