| 摘要 |
PROBLEM TO BE SOLVED: To detect nonadhesion of a ball in a short time, by applying voltage to a wire in a period until cutting a wire from the root of the ball after connecting the ball to a semiconductor chip, and detecting the change of voltage during the period by the existence of nonadhesion of the ball, and judging the existence of ball nonadhesion. SOLUTION: A control circuit 25 inputs a positive or negative threshold which shows the voltage level for judging the nonadhesion into a threshold signal generating circuit 26, and the threshold signal generating circuit 26 inputs a positive or negative threshold signal into a comparison circuit 24. The comparison circuit 24 outputs a set signal S in case that the value of a displacement signal gets over the positive or negative threshold, and when this set signal S is inputted into a self holding circuit 27, the self holding circuit 27 holds a nonadhesion judgment signal Q in ON condition, and this nonadhesion judgment signal Q is inputted into the control circuit 25, and the control circuit 25 outputs an abnormality detection signal U into a bonder. Hereby, this device can detect ball nonadhesion in bump bonding in a short time. |
