| 摘要 |
PROBLEM TO BE SOLVED: To obtain a wiring board for mounting bare chips and a method of manufacturing the same, which can suppress damages to the bare chips during mounting. SOLUTION: This is a wiring board 10 for mounting having a structure, such that a semiconductor chip 8 having solder bumps 14 can be mounted and circuit wiring 2 is arranged on an insulating substrate 1. In this case, the board 10 is provided with projecting electrodes 3 electrically connected to the corresponding bumps 14 being stuck thereto, and with an adhesive layer 5 and conductive members 4 on one surface of the substrate 1. The members 4 pass through the layer 5 and are electrically connected to the wiring 2, whereas the electrodes 3 are fixed to the substrate 1 by the layer 5, being electrically connected to the corresponding members 4. |
