FORMING METHOD OF WIRING PATTERN AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a forming method of a wiring pattern capable of forming a fine wiring pattern without using resist like a dry film, and a semiconductor device in which a semiconductor element is mounted on a wiring board formed by the above method. SOLUTION: This forming method includes a first process wherein a surface layer of a copper foil 202 formed on an insulating substrate 201 is changed to Cu3P(copper phosphide) having etching durability, and a Cu3P film 203 is formed; a second process wherein parts in the Cu3P film 203 which correspond to a desired pattern are left, and the Cu3P film 203 in the other parts is eliminated; a third process for eliminating the copper foil 202 except the parts corresponding to the desired pattern; and a forth process wherein the Cu3P film 203 corresponding to the desired pattern of the copper foil 202 is eliminated, and the desired pattern is formed on the insulating substrate 201.