| 摘要 |
PROBLEM TO BE SOLVED: To achieve a manufacturing method, wherein a resin can be applied to a wire-bond mounting section so that no voids remain within the resin without increasing the sealing region and application time, in a resin-sealed semiconductor device. SOLUTION: Semiconductor chips 21 to 26 mounted on a board 10 are wire- bonded to the board 10 with wires 30, after which first resin portions 40 are applied to connecting parts between the wires 30 and the board 10, using a dispenser in a manner filling the clearances between the wires 30 and the board 10. Thereafter, second resin portions 50 are applied onto the chips 21 to 26 using the dispenser, the resin portions 50 having a lower viscosity than that of the resin portions 40, and successively the resin portions 40 and 50 are cured. |
