| 摘要 |
PROBLEM TO BE SOLVED: To prevent warping or deforming of a frame in the assembly process of an IC, by equipping it with a circuit part consisting of a wiring pattern for electrically connecting an IC chip mounted on itself, and a metallic pattern arranged at each side of the peripheral section of the frame for a semiconductor device. SOLUTION: A circuit part consisting of a wiring pattern 3 to be electrically connected with an IC chip is arranged on base material 2 consisting of resin such as glass epoxy, polyimide, or the like constituting the resinous frame 1 for a semiconductor device. The circuit part of this wiring pattern 3 consists of metal such as Cu, Ni, Au, or the like, or its alloy, and the thickness is 20-50μm. Moreover, a metallic pattern 4 consisting of the same material as the wiring pattern 3 is arranged at the margin of one side of the base material 2 constituting the resinous frame 1. Hereby, the metallic pattern 4 can raise the entire heat conductivity of the resinous frame 1, and it can prevent the transformation of the resinous frame 1 caused by partial heating. |
