发明名称 TRANSFER TOOL OF FILM-SHAPED SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To obtain the transfer tool of a film-shaped substrate that prevents the waste and the decrease in work efficiency on the conveyance of a film- shaped substrate, and can surely eliminate damages to the film-shaped substrate. SOLUTION: A transfer tool 1 of a film-shaped substrate has a tool body 16, that is used in a transfer path R of a film-shaped substrate 2 and places the film-shaped substrate 2. In this case, two holes 201 being formed on the film-shaped substrate 2 are inserted into two tapered pins 19a and 19b installed at the tool body 16, thus retaining the film-shaped substrate 2.
申请公布号 JP2000306975(A) 申请公布日期 2000.11.02
申请号 JP19990116224 申请日期 1999.04.23
申请人 RICOH CO LTD 发明人 KANEKO TAKASHI;SUZUKI TAKUMI
分类号 B65D85/86;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65D85/86
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