| 摘要 |
PROBLEM TO BE SOLVED: To reduce the emission of radiation noise occurred by the leakage of the component of high frequency current overlapped with a power line to a board end part, by installing a power conductor layer connected to the power line as a conductor layer and a ground conductor layer connected to a ground line and forming them by means of making them face each other through an insulating layer. SOLUTION: In a multilayer printed board 11, the conductor layers 12a, 12b, 12c and 12d of four layers formed of the thin films of copper are stacked in a state where they are separated by the insulating layers 13a, 13b and 13c of three layers formed of thin films made of glass epoxy. The conductor layer 12b in the conductor layers 12b and 12c installed on an inner side is used as a power conductor layer connected to the power line and the conductor layer 12c is used as the ground conductor layer connected to a ground line. The conductor layers 12a and 12d exposed to a surface are used as signal conductor layers. Thus, the conductor layer 12b and the conductor layer 12c are formed in a confronted state through the insulating layer 13b.
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