| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a package, and to assure sufficient clearance between wires while constraint on combination of semiconductor chips which are laminated is reduced. SOLUTION: Semiconductor chips 1, 2, and 3 are connected to a substrate 4 by a reverse method of a ball bonding method. Specifically, after fast bonding to the bonding pad on the substrate 4, a gold wire is led to the bonding pad of the laminated semiconductor chip 1 for second bonding, to form a wire 6 which connects the semiconductor chip 1 to the substrate 4. Similarly, the semiconductor chips 2 and 3 are sequentially connected to the substrate 4 from a lower layer. |
