发明名称 WIRING BOARD FOR MOUNTING BARE CHIP AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To obtain a wiring board for mounting a bare chip capable of suppressing damages to the bare chip during mounting. SOLUTION: This wiring board 10 for mounting a bare chip is used to mount a bare chip 8 having aluminum electrodes 9. The board 10 has a structure, such that circuit wiring 2 is provided on an insulating substrate 1. Further, the board 10 has projecting electrodes 3 electrically connected to the corresponding electrodes 9, being stuck thereto. An adhesive layer 5 and conductive members 4 are provided on one surface of the substrate 1. The members 4 pass through the layer 5 and are electrically connected to the wiring 2. The electrodes 3 are fixed to the substrate 1 by the layer 5, being electrically connected to the corresponding members 4.
申请公布号 JP2000306953(A) 申请公布日期 2000.11.02
申请号 JP19990112565 申请日期 1999.04.20
申请人 NITTO DENKO CORP 发明人 OKEYUI TAKUJI;SUGIMOTO MASAKAZU;NAGASAWA TOKU;INOUE YASUSHI;NAKAMURA KEI
分类号 H01L23/12;H01L21/60;H05K1/18 主分类号 H01L23/12
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