WAFER-CUTTING METHOD AND APPARATUS

摘要

PROBLEM TO BE SOLVED: To cut a wafer having a defective part to obtain stably quality of chip without defective parts. SOLUTION: A wafer 4 is held in a wafer holding step 5 on an XY table 3. A circular part piece which is cylindrical is adhered on a position, corresponding to a defective part on the wafer 4 to cover the defective with the piece. Warpage of the wafer 4 at a cut position is measured by a laser range finder 9, the XY and X tables 3 and 12 are properly driven, while irradiating a laser beam 15 from a laser irradiating means 13 to thereby cut out a singled chip. Thereafter, the XY table 3 is driven to move the laser irradiating means 13 to the next cut position. Upon measuring warpage at the cut position, when a step caused by the piece is detected, then the XY table 3 is driven without irradiating the laser beam 15 to the next cut position. The thus cut chips have no defectives mixed in and can be made stable in quality.