| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaged semiconductor device, together with its manufacturing method, wherein a circuit analysis of a semiconductor element chip sealed inside is prevented surely. SOLUTION: Related to a semiconductor device 1, in order that a semiconductor element chip 2 sealed in a package 8 is held in a predetermined deformed state, it is press-fitted onto a deformed die-pad 3. A protruding or recessed bent-deformation is preferred as a specified deformed state. Since semiconductor element chip 2 operates correctly in the deformed state, the bent deformation is released for malfunction when the semiconductor element chip 2 is peeled off the semiconductor device to be a single body. As a result, the semiconductor element chip 2 is surely prevented from a circuit analysis. |
