SHAPE MEASURING APPARATUS AND SHAPE MEASURING METHOD OF SOLDER FILLET

摘要

PROBLEM TO BE SOLVED: To measure the whole shape of a solder fillet like a chip component which is packaged in high density. SOLUTION: A solder fillet 3 is lighted at any time with illuminations 11-16 by control of an illumination control part 9 and the image is picked up every lighting with a CCD camera 10. In an image processing part 17, inclination of the solder fillet 3 at an adress is obtained on the basis of luminance of a picture element of the same adress in each picked-up image. A relational expression of a straight line is obtained by mathematically approximating the inclination and integrated. Thereby the shape of the solder fillet is approximated to a quadratic function and measured.