LEAD FRAME, RESIN-SEALED-TYPE SEMICONDUCTOR DEVICE USING LEAD FRAME, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To improve the reliability when mounting a substrate by arranging the land electrode of a lead part and that of a land lead part straightly in two rows and hence achieving a semiconductor device of a surface-mount type. SOLUTION: A land lead part 4 and a lead part 5 of a lead frame are arranged in parallel in alternate arrangement while being connected to a frame rim 2. However, in an arrangement opposing a die pad part 1, the tip part of the land lead part 4 is routed to the tip part of the lead part 5, and tips are arranged on the same straight line for composing two rows. In the arrangement, when a semiconductor element is to be mounted and resin is to be sealed, two rows of external terminals are arranged in a lattice on the bottom surface of a package, and the bottom surface of the tip part of the land lead part 4 and that of the lead part 5 are arranged on the bottom surface of the package, thus achieving a surface-mount-type semiconductor device and improving the reliability for mounting the substrate.