发明名称 MICROLENS ARRAY FOR SOLID-STATE IMAGE PICKUP ELEMENT AND SOLID-STATE IMAGE PICKUP ELEMENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a microlens array which enhances the light receiving efficiency of the light receiving part of a solid-state image pickup element and enhances the sensitivity and image quality of a solid-state image pickup device. SOLUTION: A light receiving part 12, a light shielding part 13, a flattening layer 14, a color filter layer 15 and an overcoat layer 16 are formed on a semiconductor substrate 11, a resin pattern layer is formed by using a positive type resist adjusted so as to ensure an extinction coefficient of 0.57×10-3 at 450 nm wavelength and convex microlenses 21 are formed by heating and softening the resin pattern layer at 130 deg.C to obtain the objective solid-state image pickup element 10 with a microlens array 22. When a filling rate improving layer 31 having 0.09μm thickness is further formed on the microlenses 21 using an acrylic resin adjusted so as to ensure a refractive index of 1.45 at 450 nm wavelength, the objective solid-state image pickup element 20 with a microlens array 32 is obtained.
申请公布号 JP2000304906(A) 申请公布日期 2000.11.02
申请号 JP19990116472 申请日期 1999.04.23
申请人 TOPPAN PRINTING CO LTD 发明人 KOGA OSAMU;ISHIMATSU TADASHI;FUKUYOSHI KENZO
分类号 G02B3/00;H01L27/14;H01L31/0232;H04N5/335;H04N5/369;(IPC1-7):G02B3/00;H01L31/023 主分类号 G02B3/00
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