发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE, AND SEMICONDUCTOR MANUFACTURE DEVICE AND MANUFACTURE SYSTEM
摘要 PROBLEM TO BE SOLVED: To raise the yield of a semiconductor device by comparing the information sensed from on a semiconductor substrate with the criteria of selection, and selecting a semiconductor manufacturing device corresponding to the information, out of plural semiconductor manufacturing devices, and applying treatment to a semiconductor substrate, using the selected semiconductor manufacturing device. SOLUTION: A semiconductor substrate W is carried to the nth foreign matter remover PAn in condition that it is stored in a wafer storage case after being treated with the third semiconductor manufacture device PA, and the wafer storage case 1 is placed on a mounting stage. Next, a controller compares the criteria of selection for the size of foreign matters stored in a data base DB1 with the actual size of the foreign matters, and judges whether the height of the foreign matters is measurable or not. Then, it there is necessity to remove the foreign matters, it selects the foreign matter removing section of the foreign matter remover PAn itself, and removes the foreign matters from the semiconductor substrate W with its foreign matter removing section.
申请公布号 JP2000306963(A) 申请公布日期 2000.11.02
申请号 JP19990114629 申请日期 1999.04.22
申请人 MITSUBISHI ELECTRIC CORP 发明人 OZAKI KOJI
分类号 H01L21/304;H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/304
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