| 摘要 |
<p>An adhesive composition comprising (1) a phosphoric acid ester specified by general formula (I), (2) a phenolic hydroxyl-containing aromatic compound having a softening point of 60 to 200 DEG C, (3) an epoxy resin and (4) a carboxyl-containing nitrile-butadine rubber, a ratio of the components (2), (3) and (4) being 0 < the component (2)/(the component (3) + the component (4)) < 1. The composition is suitable for use in a printed circuit board, especially for a flexible printed circuit board. The invention also provides a flexible printed circuit board prepared by using the adhesive composition.</p> |
