| 摘要 |
PROBLEM TO BE SOLVED: To complete the transfer and the melt-sticking of solder balls by means of one process by installing a heating device in a transfer device where the solder balls are mounted on the outer electrodes of electronic parts and melt-sticking the solder balls to the outer electrodes by the heating device. SOLUTION: A transfer device 3 is installed above a transportation device where electronic parts B placed by making faces on which multiple outer electrodes 1 are arranged as upper faces are intermittently transported through a connection mallet 2 extended from an elevation device so that it freely ascends/descends. The upper outer periphery of the transfer device 3 is covered by a shielding cover 4 and a micro wave oscillator 5 as a heating device is arranged in the shielding cover 4. A solder ball 6 adsorbed to the lower face of the transfer device 3 is transferred onto the outer electrode 1 at the rear face of the electronic part B, a micro wave is emitted from the micro wave oscillator 5, the solder ball 6 is heated/melted by the micro wave and it is melt-stuck to the outer electrode 1. Thus, the transfer and the melt-sticking of the solder ball 6 can be completed by one process. |
