发明名称 |
Manufacture of flip-chip devices |
摘要 |
The specification describes a process for applying under bump metallization (UBM) for solder bump interconnections on interconnection substrates. The process uses a lift-off technique for defining the UBM and the lift-off technique has improved edge definition as the result of radiation hardening of the photoresist after lithographic patterning. <IMAGE> <IMAGE> |
申请公布号 |
EP0939436(A3) |
申请公布日期 |
2000.11.02 |
申请号 |
EP19990301129 |
申请日期 |
1999.02.16 |
申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
AHLQUIST, LOUIS NELSON;DEGANI, YINON |
分类号 |
H01L21/48;H01L21/60 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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