| 摘要 |
<p>In a method of manufacturing a multilayer wiring board according to the present invention having the step of after forming a column-like metallic body on a lower wiring layer, forming an upper wiring layer whose part is conductively connected with the column-like metallic body, the column-like metallic body is formed by the step of coating the lower wiring layer with a conductor showing durability at the time of etching metal composing the column-like metallic body so as to form a conductive layer, the step of forming a plating layer of the metal composing the column-like metallic body on a whole surface including the conductive layer, the step of forming a mask layer on a surface portion of the plating layer where the column-like metallic body is formed, and the step of etching the plating layer. The present invention can provide the method of manufacturing a multilayer wiring board which can form the column-like metallic body having uniform height for short time according to a simple and low-priced method. <IMAGE> <IMAGE> <IMAGE></p> |
