| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of a semiconductor device module mounted on an IC card for improved reliability. SOLUTION: A semiconductor device module 10 comprises a metal pattern 19 which comprises a plurality of external terminal leads 11, an insulating adhesive sheet 14 bonded to the metal pattern 19, a semiconductor chip 15 mounted on the insulating adhesive sheet 14, a bonding wire 18 which connects an electrode of the semiconductor chip 15 to the external terminal lead 11, and a sealing resin 16 which seals the semiconductor chip 15 and bonding wire 18. Thus, the limit on the sides of semiconductor chip 15 is relaxed and the external stress applied on the module is absorbed by the deflection of the external lead terminal 11, preventing damage to the module 10. |
