SEMICONDUCTOR DYNAMIC VALUE SENSOR AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To effectively prevent entrance of dust into a dynamic value detecting part of a sensor chip, with a simple configuration. SOLUTION: A sensor chip 2 comprising an acceleration detecting part 8 of a fine structure is mounted in a mount region of a signal processing chip 3 comprises a signal processing circuit and bonded with an adhesive sheet 16. Electrode pads 9 and 10 of the sensor chip 2 are electrically connected to electrode pads 14 and 15 of the signal processing chip 3 with tape leads 17 and 18 of a film carrier tape 4. At this time, the film carrier tape 4 is provided with a cover part 4b which covers the upper surface part of the acceleration detecting part 8. The acceleration detecting part 8 is recessed to assure a clearance of a required amount against the film carrier tape 4.