发明名称 SILICON THERMOPILE
摘要 PROBLEM TO BE SOLVED: To provide a silicon thermopile, which is raised in sensitivity by forming a polysilicon film at a high integration degree and has high resolution appropriate as an image sensor. SOLUTION: An insulating film 2 is provided on a silicon substrate, a polysilicon film 3 is continuously formed in a comb-teeth form on the upper surface of this film 2 this polysilicon film 3 is doped with p+ impurities and n+ impurities, a plurality of rectangular p+-doped polysilicon regions 4 and a plurality of rectangular n+-doped polysilicon regions 5 are alternately formed in a state that the regions 4 and the regions 5 are independent from each other to constitute a plurality of thermocouples 6, contact holes 7 are formed so as to lie over the adjacent regions 4 and 5 and the regions 4 and 5 coming into contact with each other in these contact holes 7 are electrically connected with each other.
申请公布号 JP2000307159(A) 申请公布日期 2000.11.02
申请号 JP19990115602 申请日期 1999.04.23
申请人 HORIBA LTD 发明人 NAKADA YOSHIAKI;MIMURA SUSUMU
分类号 H01L35/32;G01J1/02;H01L35/14;(IPC1-7):H01L35/32 主分类号 H01L35/32
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