| 摘要 |
A ball grid array mounting for an integrated circuit chip (3) has an insulating plate (2), on the upper surface of which is positioned the chip (3), the surface having been completely coated with epoxy resin (1) to the periphery of the plate (2) and extending also over its edges. On the lower face of the plate is a grid of connecting balls (5). Each ball is connected to a connection electrode (6) to a point on the upper surface of the chip via a metallised hole (8) through the plate (2), conducting tracks (10,14) and a second connection electrode (7). The conducting tracks are all covered with the epoxy resin. Also claimed is the prodn. of the array by: making the insulating plate (92), placing the chip (3) on the surface, placing the unit in an injection mould, injecting the epoxy resin into the mould to encapsulate the chip on the upper face of the insulating plate. <IMAGE> |
