Large area vacuum laser beam processing apparatus, e.g. for micro structuring semiconductor wafer surfaces, has a rotating window disk sealed by an O-ring seal and provided with a smaller window

摘要

Large area vacuum laser beam workpiece processing apparatus, comprises a relatively rotating circular window plate (2) sealed by an O-ring seal and provided with a smaller window (3). The parent patent (DE19801612) claims a large area vacuum laser beam workpiece processing apparatus, comprising a work chamber with top and bottom plates, one or more lasers, laser beam guiding and shaping devices, a gas supply system, a vacuum generator and a drive system, the chamber top plate having a small opening. In this patent of addition, the novelty is that: (a) a circular window plate (2) is freely and/or rotationally mounted on the top plate (4) which has a circular opening (6); (b) a projecting O-ring seal is fitted in a top plate or window plate groove (7) around the opening (6) between the top plate and the window plate so the window plate completely covers the O-ring seal; (c) a smaller window (3) is provided in the window plate within the O-ring seal; and (d) the window plate and/or the work chamber (1) is connected to the drive.