A WAFER RETAINER FOR RETAINING A WAFER TO BE POLISHED AND A METHOD FOR ATTACHING/DETACHING THE WAFER TO/FROM A BASE PLATE OF A POLISHING MACHINE

摘要

A wafer retainer for retaining a wafer to be polished according to the present invention includes: a foam layer (2) capable of adsorbing a wafer on a surface of the foam layer (2) in a detachable manner; a pressure-sensitive adhesive layer (3) for attaching the foam layer (2) to a base plate (7) of a polishing machine; and a release sheet (4) attached to the pressure-sensitive adhesive layer (3) in a releasable manner, wherein the pressure-sensitive adhesive layer (3) includes an adhesive composition containing a polymer, the polymer having a first-order melt transition in a temperature range narrower than 15 DEG C. Thus, the present invention provides a wafer retainer and a method for attaching/detaching the wafer retainer to/from a base plate of a polishing machine such that the wafer retainer can be peeled off the base plate by simply cooling the base plate (7) and the adhesive layer (3) of the wafer retainer, thereby facilitating the exchanging or replacement of the wafer retainer occurring after each polishing process.