| 摘要 |
A process for joining, sealing and/or encapsulating an object comprising the steps of, providing a quantity of solid thermoplastics adhesive (8), positioning the solid adhesive on the object, melting the adhesive by applying heat of a predetermined magnitude and for a predetermined duration by irradiation with infra-red radiation having a wavelength in the range from 700nm to 1500nm, the source of infra-red radiation (2) being located remotely from the object and the infra-red energy being transmitted to a position close to the object via an optical fibre or liquid filled light guide (6), the heat being applied without directly contacting the object or the adhesive. The adhesive 8 may be applied to the object in powdered form or in a pre-shaped form. The hot melt adhesive 8 is typically based on polyamides, polyethylene. EVA, polypropylene or polybutyl materials. The adhesive is typically melted in the range 150 {C to 180 {C. |
