| 摘要 |
<p>PURPOSE: A method for polishing wafers is provided to be capable of improving the planarization by reducing the amount of slurry and removing a slurry transfer problem over the entire surface of a substrate wafer. CONSTITUTION: A method for polishing wafers applies a polishing composition on the surface of a sample. The polishing composition floats polishing medium minute particles and the minute particles and includes a film formation binder for forming a temporary film on the surfacer of the sample. The temporary film can be dissolved in polishing water subsequently employed. Thus, the polishing medium minute particles are freed to polish the sample. The film formation binder is dissolved and the polishing medium minute particles are thus freed. The freed particles are allowed to grind the surface of the sample, so that the surface of the sample is polished or planarized.</p> |
