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发明名称
WINDING REEL FOR PACKING A SEMICONDUCTOR PACKAGE WHICH CAN WELDING BY REEL MATERIAL ELASTICITY
摘要
申请公布号
KR200201234(Y1)
申请公布日期
2000.11.01
申请号
KR20000014228U
申请日期
2000.05.19
申请人
YOONHO TECH CO., LTD.
发明人
BYUN, HO SAN
分类号
B65H75/00;(IPC1-7):B65H75/00
主分类号
B65H75/00
代理机构
代理人
主权项
地址
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