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发明名称
CMP FOR LAGER DIAMETER OF SILICON WAFER AND METHOD USING THE CMP MACHINE
摘要
申请公布号
KR200201955(Y1)
申请公布日期
2000.11.01
申请号
KR20000015196U
申请日期
2000.05.29
申请人
HWANG, BYUNG RYUL
发明人
HWANG, BYUNG RYUL
分类号
H01L21/302;(IPC1-7):H01L21/302
主分类号
H01L21/302
代理机构
代理人
主权项
地址
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