LEAD FRAME STRUCTURE CLEANING TYPE OF MOLD SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A frame structure for cleaning is provided to improve a cleaning performance of a mold die and reduce the cleaning cost by not allowing a paper frame to shield an air bent of the mold die. CONSTITUTION: A frame structure for cleaning cleans mold dies for molding semiconductor packages. The frame is formed of a material enhanced means(6) formed on frames(1,1') of a paper material. The material enhanced means(6) includes a metal plating or a metal tape.