发明名称 |
METHOD FOR MANUFACTURING DRAM |
摘要 |
PURPOSE: A method for manufacturing DRAM is provided to remove polymer on the surface of semiconductor devices and to obviate additional contaminant generated in a chamber and due to a charging effect in an ashing method. CONSTITUTION: A method for manufacturing DRAM forms a gate oxide film(112) on a semiconductor substrate(110). The first polysilicon film(114) is formed on the gate oxide film(112). A W film(116) being a gate electrode is formed on the first polysilicon film(114). An insulating film(118) is formed on the oxide film(112) including the gate electrode(116). The second polysilicon film(120) for forming a bit line is formed on the insulating film(118) and an etch-back process is then performed. A cleaning process of removing polymer generated in the etch-back process is implemented. A WSi film(122) is formed on the second polysilicon film(120).
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申请公布号 |
KR100266900(B1) |
申请公布日期 |
2000.11.01 |
申请号 |
KR19980008071 |
申请日期 |
1998.03.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HONG, YEONG GI;SON, HONG SEONG |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
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